发明名称 MANUFACTURE OF FOAMED HEAT INSULATION BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a foamed heat insulation board employing an open injection method without employing a closed injection method and, in this instance, prevent the occurrence of deformation such as warpage without using another new sealing material or an outer peripheral frame sustaining mold. SOLUTION: The manufacturing method of a foamed heat insulation board comprises the steps of inserting an outer peripheral frame 7 between an upper surface board 5 and a lower surface board 6, defining a closed space by fastening integrally the upper and lower surface boards 5, 6 and outer peripheral frame 7 and, at the time of injecting foaming resin liquid, after fabricating a tentative assembly of the upper and lower surface boards 5, 6 and outer peripheral frame 7 in a foaming mold including a lower mold 1 and an upper mold 3, absorbing and separating the upper surface board 5 by absorption materials set on the upper mold 3, and open-injecting foaming resin liquid 9 into a space defined by a lower surface board 6 stayed in the lower mold 1 and the outer peripheral frame 7. Also, it is preferable that a temperature difference is previously made in a preheating temperature between the upper surface board 5 and the lower surface board 6 by the upper and lower molds 1, 3.
申请公布号 JPH1086160(A) 申请公布日期 1998.04.07
申请号 JP19960266589 申请日期 1996.09.18
申请人 NIPPON PAFUTEMU KK 发明人 ONO NORIHIKO;NAKA REIJI;OBARA ISAO
分类号 B29C33/04;B29C33/30;B29C33/38;B29C39/10;B29C39/26;B29K75/00;B29K105/04;(IPC1-7):B29C39/10 主分类号 B29C33/04
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