Method and apparatus for bonding using brazing material

摘要

PCT No. PCT/JP94/00562 Sec. 371 Date Feb. 10, 1995 Sec. 102(e) Date Feb. 10, 1995 PCT Filed Apr. 5, 1994 PCT Pub. No. WO94/22628 PCT Pub. Date Oct. 13, 1994High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. The components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by directing the reactive gas flow containing the active species at the component surfaces. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove organic substances or oxide film surfaces.