| 摘要 |
PROBLEM TO BE SOLVED: To obtain plating coating contg. W, low in stress and excellent in a secular change in the case of use and process stability, surface conditions and precision by precipitating an alloy of Ni, Fe or Co with W on the surface of a plating base electrode formed on the surface of the material to be plated by an electrolytic plating method. SOLUTION: A plating base electrode is formed on the surface of the material to be plated, thereafter, the surface of the base electrode is provided with a pattern of nonconducting substance having an opening with a prescribed shape, and after that, any coating of an alloy of W and Ni, W and Fe or W and Co is precipitated by an electrolytic method to form plating coating having a uniform compsn. contg. W only in the opening, having high density and excellent in precision. This alloy plating coating is the one composed of a low crystalline alloy, having a low thermal expansion coefficient, high in hardness, excellent in wear resistance, furthermore having resistance to acid such as concentrated nitric acid and alkali and stable. Thus, a mask for X-ray lithograpy and a mold for molding high in X-ray absorptivity, low in stress and excellent in a secular change in the case of use and process stability, surface conditions and precision can be obtd. |
