| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition containing a specific polyhydroxy compound, capable of giving cured products excellent in heat resistance, mechanical characteristics, etc., from simply produced raw materials in states saved in energy and reduced in drainage, and useful in the field of electric and electronic parts, etc. SOLUTION: This epoxy resin composition comprises (A) highly pure 1,1,2,2- tetrakis(4-hydroxy-3,5-dimethyphenyl)ethane obtained by subjecting (A) the two molecules of (A1 ) bis(3,5-dimethyl-4-hydroxyphenyl) methane to a dehydrogenation condensation, and (B) an epoxy resin. The components A and B are contained so that the OH of the component A is contained in an amount of 0.5-2 moles per mole of the epoxy group of the component B. The component A is obtained e.g. by blowing air or oxygen into the melted component A1 at a temperature of 180-300 deg.C in the absence of a catalyst and simultaneously subjecting the component A1 to a dehydrogenation condensation reaction. |
