发明名称 Semiconductor device and associated fabrication method
摘要 Mounted on a single semiconductor substrate are a DRAM, MOS transistor, resistor, and capacitor. The gate electrode of the DRAM and the gate electrode of the MOS transistor are formed by a common layer (i.e., a first-level poly-Si layer). The storage electrode of the DRAM. the resistor, and the lower electrode of the capacitor are formed by a common layer (i.e., a third-level poly-Si layer). The plate electrode of the DRAM and the upper electrode of the capacitor are formed by a common layer (i.e., a fourth-level poly-Si layer).
申请公布号 US5736421(A) 申请公布日期 1998.04.07
申请号 US19960589897 申请日期 1996.01.23
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SHIMOMURA, HIROSHI;MORITA, KIYOYUKI;NAKABAYASHI, TAKASHI;UEHARA, TAKASHI;YASUHIRA, MITSUO;SEGAWA, MIZUKI;HIRAI, TAKEHIRO
分类号 H01L21/768;H01L21/8239;H01L21/8242;H01L27/06;H01L27/105;H01L27/108;(IPC1-7):H01L21/70 主分类号 H01L21/768
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