| 发明名称 |
METHOD OF TREATING SURFACE OF WIRING ON CIRCUIT BOARD |
| 摘要 |
<p>Disclosed is a method for treating a surface of wiring on a circuit board. Wiring (12) of tungsten (W), copper (Cu) and any of their alloys is formed on a circuit board (11). A nickel alloy layer (20) containing boron (B) is formed as a film on the surface of the wiring (12). An electronic component (16,18) is connected to the nickel alloy layer (20) by means of a solder (17) and an aluminum bonding wire (19). The Ni-B alloy layer (20) has a boron content of about 1% by weight and is formed by electroplating or the like. The Ni-B alloy layer (20) should have a film thickness of 5 mu m or more. <IMAGE></p> |
| 申请公布号 |
KR0127277(B1) |
申请公布日期 |
1998.04.06 |
| 申请号 |
KR19930015341 |
申请日期 |
1993.08.17 |
| 申请人 |
TOYODA JIDOSHOKKI SEISAKUSHO KK. |
发明人 |
MIYAZAKI, YUKIYASU;SUGITANI, NOBUYOSHI;SHIMOJI, YOSHIAKI |
| 分类号 |
H01L21/60;H01L21/48;H01L23/498;H05K1/09;H05K3/24;H05K3/34;(IPC1-7):H05K1/09 |
主分类号 |
H01L21/60 |
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