| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board which can effectively avoid wiring line disconnection caused by the corrosion of a thin-film wiring conductive layer, when a water content contained in the air is introduced into the wiring board and can thus stably exhibit functions as a wiring board over a long time period. SOLUTION: This multilayered wiring board includes a substrate 1 and a multilayered wiring part 4. The wiring part 4 has a plurality of organic resin insulating layers 2 and thin-film wiring conductive layers 3 coated on the substrate 1 laminated alternately. The layers 3 located above end lealow are electrically connected via through-hole conductors 8 provided in the organic resin insulating layers 2. The insulating layer 2a as uppermost layer is set to have a thickness of 10μm or more and a water absorption of 2.0% or less. |
