UV- und thermisch härtbare Epoxidharze zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen
摘要
UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 mum and a siloxane component are provided in addition to the casting resin formulation.
申请公布号
DE19638630(A1)
申请公布日期
1998.04.02
申请号
DE1996138630
申请日期
1996.09.20
申请人
SIEMENS AG, 80333 MUENCHEN, DE
发明人
LEHNER, BARBARA, 80687 MUENCHEN, DE;SEZI, RECAI, DR., 91341 ROETTENBACH, DE
