PROBING APPARATUS OF SEMICONDUCTOR WAFER

摘要

When activating pressure means after placing a semiconductor chip(14) which is to be tested at the lower part of device's body(11) with keeping some distance in between, the probing material(12) which is packed at the container(11d)'s space part(11a) flows to the lower part due to the pressure. The flowing down probe material(12) flows into the guide hole(13a) through the probing material transferring path(11b) and flows out in thin line form like the guide hole(13a)'s shape. The probing material(12) which flew out in thin line form connect electrically because it came in contact with semiconductor chip(14)'s each pad(14a) at the lower part. The probing material(12) which is connected to the semiconductor chip(14)'s each pad(14a) becomes testable state by being connected to the tester by the contact electrode(11c) which is added to the probing material transfer path(11b).