| 摘要 |
PURPOSE:To manufacture metal parts economically by subjecting each metal part to printed wiring while a compound layer of aromatic polyamide-imide resin soluble in organic solvent is used as a base film/adhesive layer in the condition that the metal part is equipped at least partially with flexibility. CONSTITUTION:A solution of aromatic polyamide-imide resin is applied to a certain place of a metal part 1 and dried to form a heat resistant insulative resin layer 2. A copper foil 3 is placed on this resin layer 2 half dried to a degree equipped with adhesiveness and attached fast by heating and pressurizing. On the copper foil 3, wiring patterns 4 are formed using a pattern resist, and after etching, the resist is exfoliated to produce the patterns. An overcoat layer 5 is provided in the necessary places on the printed wirings, and a rust-proof film 6 is applied to the exposed wiring parts. A specified portion of the metal part is removed to equip the printed wiring board partially with flexibility, and a part 9 is furnished where the layer 2 is used as the base layer having flexibility. Thereby the part can be constructed light and thin. |
