MICROELECTRONIC PLASTIC PACKAGE MOISTURE AND METHOD PERMEATE FOR CONTAMINATED MATERIAL

摘要

The integrated circuit die and the metal lead frame are plastic packaged as the following steps. (a) To form the contact strengthening layer at the first location of the lead frame where the molding compound forms a boundary with the lead frame is to be formed, preprocess the lead frame selectively. (b) Remove the contact strengthening layer from the second location or masking the second location of the lead frame which is assigned to the lead frame electric contact point regions. (c) Plate the lead frame electric contact point regions with the conductive metal. (d) After placing the die at the center of the lead frame, wire bond the die electric contact point pads to the designated lead fingers at the assigned location. (e) Contact the plastic molding compound and the lead frame at the first location with facing each other by molding the die circumference and the lead frame excluding the lead finger that is extended from the plastic body with plastic molding compound.