发明名称 |
Anschlußrahmen für ein mikroelektronisches Bauteil, Verfahren zu dessen Herstellung und den Anschlußrahmen umfassendes mikroelektronisches Bauteil |
摘要 |
The present invention pertains to a connecting frame (1) for a microelectronic component, comprising a plurality of connecting pins (2) and an island (3) for securing a semiconductor chip. The connecting frame is characterized in that a portion (5) of the island (3) has foldings on two or more lines, which emerge from the island plane. Once the semiconductor chip (4) is mounted and a plastic casing (9) has been built, the folded portion presents an end area preferably so designed as to define a housing surface or to protrude above same. The end area (7) can be so connected to a printed circuit card or heat sink that the heat leakage inside the casing (9) can be efficiently dispelled therefrom. The invention also relates to a preliminary module to the connecting frame, the manufacturing process of said connecting frame and the microelectronic component encompassing same. |
申请公布号 |
DE19639183(A1) |
申请公布日期 |
1998.04.02 |
申请号 |
DE1996139183 |
申请日期 |
1996.09.24 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
PAPE, HEINZ, DIPL.-PHYS., 81825 MUENCHEN, DE |
分类号 |
H01L23/495;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|