LEADFRAME FOR A MICROELECTRONIC COMPONENT

摘要

The invention concerns a microelectronic component whose leadframe is divided in the island region into an island edge (1) and an inner part (2) which is countersunk relative thereto, the island edge (1) being designed to hold an electronic component and mechanically and thermally connected thereto. The countersunk inner part (2) is thermally connected to the island edge (1) via webs and acts as a heat conductor to an open heat sink which is disposed on the underside of the housing or as close as possible thereto.