发明名称 OXYDATION METHOD OF POLY-SILICON
摘要 A method for fabricating a oxide layer of polycrystalline silicon is disclosed. The method for fabricating the oxide layer of polycrystalline silicon comprises the steps of: a) forming a polycrystalline silicon(12) on a semiconductor substrate(11); b) forming a first thermal oxide layer(13) having a first thin thickness; c) depositing a silk polycrystalline silicon(14) on the first thermal oxide layer(13); d) forming a second thermal oxide layer(15) having a second thickness oxidizing the silk polycrystalline silicon(14); and e) forming a single oxide layer composing of the first and second thermal oxide layer(13,15) oxidizing overall the silk polycrystalline silicon(14). Thereby, a surface roughness of the thermal oxide layer is significantly improved oxidizing overall the thermal oxide layer.
申请公布号 KR0127316(B1) 申请公布日期 1998.04.02
申请号 KR19940008243 申请日期 1994.04.19
申请人 LG ELECTRONICS CO.,LTD 发明人 CHON, MYUNG-CHOL;KIM, KI-BUM;HAN, MIN-KOO
分类号 H01L21/31;(IPC1-7):H01L21/31 主分类号 H01L21/31
代理机构 代理人
主权项
地址