发明名称 |
OXYDATION METHOD OF POLY-SILICON |
摘要 |
A method for fabricating a oxide layer of polycrystalline silicon is disclosed. The method for fabricating the oxide layer of polycrystalline silicon comprises the steps of: a) forming a polycrystalline silicon(12) on a semiconductor substrate(11); b) forming a first thermal oxide layer(13) having a first thin thickness; c) depositing a silk polycrystalline silicon(14) on the first thermal oxide layer(13); d) forming a second thermal oxide layer(15) having a second thickness oxidizing the silk polycrystalline silicon(14); and e) forming a single oxide layer composing of the first and second thermal oxide layer(13,15) oxidizing overall the silk polycrystalline silicon(14). Thereby, a surface roughness of the thermal oxide layer is significantly improved oxidizing overall the thermal oxide layer.
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申请公布号 |
KR0127316(B1) |
申请公布日期 |
1998.04.02 |
申请号 |
KR19940008243 |
申请日期 |
1994.04.19 |
申请人 |
LG ELECTRONICS CO.,LTD |
发明人 |
CHON, MYUNG-CHOL;KIM, KI-BUM;HAN, MIN-KOO |
分类号 |
H01L21/31;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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