发明名称 Verfahren zur Waferidentifizierung in der Chipfertigung und Vorrichtung zur Durchführung des Verfahrens
摘要 In chip manufacturing (front-end manufacturing), assembly installations are controlled by a process monitoring system. To supply the installation computer with the information put on the wafers (1) to identify them, for example, the code bars on the wafers must be read. The invention proposes to conduct the wafer identification before the wafers are transferred to the process line.
申请公布号 DE19640425(A1) 申请公布日期 1998.04.02
申请号 DE19961040425 申请日期 1996.09.30
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 WOHLLEBEN, JUERGEN, 92521 SCHWARZENFELD, DE;FREUNDORFER, JOHANNES, 94560 OFFENBERG, DE
分类号 H01L21/02;H01L21/00;(IPC1-7):H01L23/544 主分类号 H01L21/02
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