Leiterrahmen für eine harzumhüllte Halbleiteranordnung

摘要

A lead frame for a semiconductor device provided with package suspension leads (11, 12, 13, 14) that have one end portion connected to an outer frame (1, 2) and that have the side of the other end portion extending into a resin encapsulation region (7), and island suspension leads (15) that have one end portion connected to the side portion of an island (3) that does not oppose the outer frame (1, 2), and another end portion extending and connected to the outer frame (1, 2) in the direction of the side of the island (3) so that a region of a depressed portion (15a- 17a) is obtained.