| 摘要 |
The present invention pertains to a connecting frame (1) for a microelectronic component, comprising a plurality of connecting pins (2) and an island (3) for securing a semiconductor chip. The connecting frame is characterized in that a portion (5) of the island (3) has foldings on two or more lines, which emerge from the island plane. Once the semiconductor chip (4) is mounted and a plastic casing (9) has been built, the folded portion presents an end area preferably so designed as to define a housing surface or to protrude above same. The end area (7) can be so connected to a printed circuit card or heat sink that the heat leakage inside the casing (9) can be efficiently dispelled therefrom. The invention also relates to a preliminary module to the connecting frame, the manufacturing process of said connecting frame and the microelectronic component encompassing same. |
