Halbleitergehäuse für Oberflächenmontage sowie Verfahren zu seiner Herstellung

摘要

A surface mount semiconductor package includes leads 38 which have bends 37 within a molded housing and formed prior to molding the housing around the lead frame 32. A single gauge of frame material is used for both the leads and the main pad area 34. The bends reduce the height of the package and reduce mechanical stresses in the molded housing.