| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform connection of a flip chip, etc., in a short time and with high reliability, by connecting electronic parts by using a resin film of an insulating resin containing insulating particles and conductive particles. SOLUTION: A resin film 11 is formed by uniformly dispersing insulating inorganic particles 12 and conductive particles 13 in a resin. The particle diameter of the insulating particles 12 is smaller than the particle diameter of the conductive particles 13. In connection of electronic components, firstly, metallic projections 28 with its upper surface shaped substantially flat are formed on a plurality of connection terminals 25 provided on a surface of a semiconductor chip 24. Nextly, the resin film 11 is provisionally pressure-bonded to a semiconductor-chip 24 mounting region on a surafe of a circuit board 26. Lastly, the semiconductor chip 24 is aligned with connection terminals 27 of the circuit board 26, thereafter the semiconductor 24 is mounted on the thermally pressure- bonded to the circuit board 26, and thus the two electronic parts are electrically joined to each other and, at the same time, can be mechanically coupled to each other by the molten resin film.</p> |
