FERROELECTRIC MATERIAL, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MEMORY, AND METHOD OF MANUFACTURING THE SAME

摘要

A ferroelectric material having a basic structure of REMnO3, said ferroelectric material comprises RE and Mn one of which is contained in excess of the other to a limit of 20 at. % or the ferroelectric material is further added with a 4-valence element. Also, a method of forming a ferroelectric material, comprises decreasing an oxygen partial pressure within a growth reactor such as a vacuum deposition reactor, and forming a film on a film-forming surface of a substrate (4) while blowing an oxidizing source thereto. This structure provides a ferroelectric material low in leak current and improved in ferroelectric characteristics. Where using the material for a semiconductor memory device, its characteristics can be improved.