BEND CORRECTION APPARATUS OF IC LEAD

摘要

A device for correcting the lateral bending of IC leads including a mold having comb-shaped pawls which are inserted into respective gaps between IC leads, wherein each of the comb-shaped pawls of the mold includes a contact member which is contacted with only the end portion of each IC lead, the end portions of the IC leads being pushed and spread out in a lateral direction by the contact members of the pawls when the pawls of the mold are inserted into the gaps. Each of the contact members is designed in a wedge shape.