发明名称 |
METHOD OF APPLYING METALLIZED CONTACTS TO A SOLAR CELL |
摘要 |
<p>A method of applying metallized contacts to the surfaces of semiconductor substrates using a conventional pad printing device. Standard screen printing inks diluted 2-30 weight percent with an appropriate solvent have been satisfactorily used to accomplish the method. For certain contact configurations, portions of the surface of the substrate are covered with a Mylar mask during the pad printing process. The method makes it possible to form a metallized contact having a uniform thickness on an uneven substrate surface, e.g., the surface of a silicon substrate produced by the EFG method.</p> |
申请公布号 |
EP0495035(B1) |
申请公布日期 |
1998.04.01 |
申请号 |
EP19910913335 |
申请日期 |
1991.07.01 |
申请人 |
ASE AMERICAS, INC. |
发明人 |
BOTTARI, FRANK, J.;HANOKA, JACK;SYLVA, FRANK, W. |
分类号 |
H01B13/00;B41F17/34;H01L21/60;H01L31/0224;H01L31/04;H05K1/00;H05K3/12;(IPC1-7):H01L21/44;H01L31/022 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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