Semiconductor body having a solder layer

摘要

A silicon semiconductor body (1), for soldering to a metallic carrier plate (2) by a metal layer sequence, has, on its back face (3), a chromium layer (4) coated with a tin layer (5). Preferably, the chromium layer (4) is a 50 nm thick sputtered layer and the tin layer (5) is a less than 3000 nm thick vapour deposited layer. Also claimed is a method of soldering the above body onto a metallic carrier plate, involving placing the body (1) on the carrier plate (2) and heating at above 250 degrees C.