发明名称 Resin etching solution and etching process
摘要 A resin etching solution comprises a hydroxyalkylamine, an alkali metal compound and water, or an aliphatic alcohol, an aliphatic amine, an alkali metal compound and water, and a process for etching a polyimide film comprises forming a resist pattern or metal layer pattern using the resin etching solution.
申请公布号 EP0832918(A1) 申请公布日期 1998.04.01
申请号 EP19970307359 申请日期 1997.09.22
申请人 TORAY ENGINEERING CO., LTD. 发明人 SUZUKI, ATSUSHI;AIMOTO, MAYUMI;KUBOTA, TAKASHI;AKITA, MASANORI;ITOH, KOJI
分类号 C08J7/12;C09K13/02;H05K1/03;H05K3/00 主分类号 C08J7/12
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