Packaging frame-mounted chip in plastic housing

摘要

Method of encasing chips (3) with a plastic housing (2), involves attaching the chips to a carrier frame (1) by means of an attachment layer (6) and connecting the chips by contact wires (4) to external connections (7), an adhesion promoting layer (5) is applied between the carrier frame or chips and the plastic housing (2). Preferably, the adhesion promoting layer (5) consists of a polyimide or an aminosilane compound, mixed with a solvent.