| 摘要 |
PROBLEM TO BE SOLVED: To realize a flexible board where an integrated circuit is mechanically mounted and electrically connected by a method wherein an IC is fixed to the IC mounting region of the flexible board and wire-bonded to a resonance circuit, and the IC is electrically connected to the resonance circuit with one of bonding wires. SOLUTION: A tag 20 is equipped with a resonance circuit composed of a capacitor 24 and a coil 22. The coil 22 is located on one of the two main surfaces of a board 26 and adjacent to the peripheral outer edge 28 of the board 26. The board 24 is provided with a region 32 where an IC 14 is housed or mounted so as to releasably support the IC 14. The IC mounting region 32 has a stable surface where the IC can be fixed and kept stationary to the board 26 and the resonance circuit 12 while an ultrasonic wire bonding operation is carried out. The IC mounting region 32 is provided adjacent to the coil 22 or the capacitor 24 and located at an upper right side on the top surface of the board 26. That is, the IC mounting region 32 is located at an optimal position, because it is adjacent to a region to which the IC 14 is electrically connected. |
