发明名称 Heat sink and fan for cooling CPU chip
摘要 Because of space limitations, a small heat sink and a fan (of about 2''x2''x+E,fra 1/2+EE '' size) is used to cool to below 105 DEG C. (at an ambient temperature of about 40 DEG C.) a CPU chip (of about 16 mmx16 mm size) which uses about 30 watts current and is mounted on a motherboard of considerably larger size. A heat transferring thermostrate washer covers the chip and a pad covers the washer. Soldered to the pad is a square heat slug. Studs extend upward from the slug. The studs fit through holes in the base of the heat sink. The heat sink is of the type having plural rectangular cross-section fins extending upwardly from the base. Above the heat sink is a fan attached to the motherboard by screws at its four corners extending through heat slug and into the motherboard.
申请公布号 US5734554(A) 申请公布日期 1998.03.31
申请号 US19960671310 申请日期 1996.07.01
申请人 SUN MICROSYSTEMS, INC. 发明人 MITTY, NAGARAJ P.;LECORNU, HERBERT E.;MALLADI, DEVIPRASAD
分类号 H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/467
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