| 摘要 |
<p>PROBLEM TO BE SOLVED: To protect chips against cracking when a semiconductor wafer is divided into the chips along scribe lines, and to prevent the semiconductor wafer from being wrongly diced deviating from scribe lines. SOLUTION: An inverted triangular groove is cut as a dicing line groove 3 in a wafer substrate on a scribe line between chips 1. Concretely, resist is applied onto the wafer substrate before transistors are formed on the wafer substrate, and a dicing line groove is patterned on the wafer substrate. Then, the applied resist is removed, and a dicing line groove is cut through an etching technique. The dicing line groove is so set in size as to enable the edge of a blade to get in it, so that the dicing line groove is formed as wide as 50 to 70μm and as deep as 150 to 250μm (nearly half as thick as a wafer so as not to break it) when the wafer substrate is 400μm in thickness.</p> |
