DIE-BONDING DEVICE,申请号JP19960257789-传众专利搜索

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发明名称	DIE-BONDING DEVICE
摘要
申请公布号	JPH1084005(A)	申请公布日期	1998.03.31
申请号	JP19960257789	申请日期	1996.09.06
申请人	TOSOK CORP	发明人	NAKATOMI YOSHIHARU
分类号	H01L21/52;(IPC1-7):H01L21/52	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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