| 摘要 |
PURPOSE: Method and system for plating semiconductor lead frame are provided to prevent abnormal extraction by controlling current on/off applied during the plating process. CONSTITUTION: In a method for plating semiconductor lead frame, an electrode and a lead frame are socked into a plating solution having electrolyte, then the current is applied to both the electrode and the lead frame to perform the plating process. When applying the current, the current is on/off controlled. That is, the current is applied for a first predetermined time, then not applied for a second predetermined time so that the chemical plating reaction occurs non continuously. The first predetermined time is about 0.5-10.0 seconds, and the second predetermined time is about 0.5-3.0 seconds.
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