| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a package of MCM IC (Multi-Chip Module). SOLUTION: A MCM IC 51 is provided with a small chip 10, a large chip 20, a wiring board 30 with electrical wiring 38 electrically connected between each of internal terminals 33 and each of external terminals 36, and an auxiliary frame 40 with electrical wiring 47 electrically connected between each of terminals 43 of the chips and each of terminals 46 of the board. The small chip 10 is arranged on the center of the wiring board 30 and each of electrode pads 13 is connected to each of the internal terminals 33 by each of connecting terminals 14. The auxiliary frame 40 engages the perimeter of the small chip 10 and each of the terminals 46 of the board is connected to each of the internal terminals 33 by each of connecting terminals 48. The large chip 20 is overlaid on the small chip 10 and the auxiliary frame 40 and each of electrode pads 23 is connected to each of the internal terminals 33 by each of connecting terminals 24. This enables a multifunction, multion, MCM IC of CSP (Chip Size Package) to be enabled by diverting various chips which have been developed.</p> |
