发明名称 RESIN MOLDING LEAD COMPONENT PART
摘要 PROBLEM TO BE SOLVED: To accurately arrange lead pins for a terminal at a narrow pitch at a low cost and in a simple process in a method for mounting a socket of an electronic component. SOLUTION: In a method for arranging lead pins for a terminal of a socket of an electronic component part, the pins 2 are arranged in V-shaped grooves 3 of a silicon pin array template 1 formed with the grooves 3 by an anisotropic etching process. After the pins 2 are arranged, they are fixed by molding resin (A) 4 and molding resin (B) 6. In such a method, the pins 2 are arrange to form the resin molding lead component part in which the pins are accurately arranged at a narrow pitch at a low cost and in a simple process.
申请公布号 JPH1080924(A) 申请公布日期 1998.03.31
申请号 JP19960237585 申请日期 1996.09.09
申请人 NEC CORP 发明人 TAKAHASHI NOBUAKI;SOEJIMA KOJI;SENBA NAOHARU;SHIMADA YUZO
分类号 B29C33/12;B29L31/36;H01L23/50;H01R43/24;(IPC1-7):B29C33/12 主分类号 B29C33/12
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