| 摘要 |
PROBLEM TO BE SOLVED: To enable user's labor to mix components to be eliminated and storage for an automatic pressurizing gelation method. SOLUTION: A composition is composed of at least one kind of epoxy resin having two or more epoxy groups in a molecule, at most 0.02 mole of N-benzyl quinolinium hexafluoro-antimonate per epoxy equivalent in a resin composition, and at most 0.02 mole of 1,1,2,2-tetraphenyl-1,2 ethane diole per epoxy equivalent. The resin composition is introduced into a mold at 30-55 deg.C, and the temperature of the mold is made 140-150 deg.C. The composition is retained in the mold until a molding is solidified enough to be removed from the mold, and the curable composition in an amount to compensate for the contraction of the composition is added continuously into the mold while the molding being cured. |
