发明名称 INFRARED SENSOR
摘要 PROBLEM TO BE SOLVED: To prevent a fault due to disconnection or peeling of a wire and to reduce the heat transfer to an infrared sensing element, by protecting a flexible circuit board constituted by a copper foil having a specific size to electrically connect a land and gold plating by using heat resistant polyimide resin having a specific thickness to a flexible base member. SOLUTION: A flexible circuit board 16 electrically couples leads 4 to an internal terminal 11. A flexible base member 17 formed of heat resistant polyimide resin having an I shape and a thickness of 10 to 257μm has lands 18 at both ends which are electrically connected by a copper foil 19 having small electric resistance, a width of 50μm and a thickness of 18 m. The lands 18 are nickel-plated at 17μm or less, and further gold-plated at 0.2μm of thickness for anti-oxidizing. Thus, since the foil 19 is reinforced by the member 17, even if its sectional area is reduced, it is not disconnected. Further, heat transfer of the foil 19 is decreased, and hence a load of a refrigerator can be diminished.
申请公布号 JPH1082694(A) 申请公布日期 1998.03.31
申请号 JP19960235098 申请日期 1996.09.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA YAYOI
分类号 G01J1/02;G01J5/02;G01J5/28;(IPC1-7):G01J1/02 主分类号 G01J1/02
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