| 摘要 |
PROBLEM TO BE SOLVED: To avoid easy disconnection of the neck part of a bonding wire even under violent oscillation and forced heat cycles by a method wherein sidewall parts suppressing the movement of gelatinous resin in a bonding pad part are provided near the bonding pad. SOLUTION: Sidewall parts 30 are provided near on both sides of a bonding pad 27. Accordingly, in the case of an oscillation test under violent oscillation setting out worse than actual applications before the actual application as well as the heat cycle test under forced accelerated heat cycle setting out worse requirements than in time of the actual application, the movement of a silicone gel 37 near the bonding pad 27 sectioned by the sidewall parts 30 is suppressed. Resultabtly, the movement near the bonding part 29 of a bonding wire 28 as well as the repeated bending at the neck part 28a are reduced for suppressing the imposition of repeated stress. Through these procedures, the disconnection of the bonding wire 28 at the neck parts 28a thereof can be suppressed. |
