发明名称 MANUFACTURING METHOD OF LAMINATED BODY
摘要 PROBLEM TO BE SOLVED: To improve the characteristics of a GaN-system compound semiconductor layer, by forming an AlN layer containing Mg on a substrate, and forming the GaN-system compound semiconductor layer on the AlN layer at a specified temperature. SOLUTION: A saphire substrate 1 is maintained at, e.g. 1,000 deg.C, NH3 is introduced into a growing chamber and the surface of the substrate 1 is nitrided. Then, the temperature of the substrate 1 is lowered to, e.g. 600 deg.C, trimethyl aluminum and NH3 are introduced, bis(ethyl cyclopentadienyl) Mg is introduced and a capped AlN layer 2 is formed. After the AlN layer 2, wherein Mg is added, is formed on the substrate 1, the substrate 1 is heated. With the temperature of the substrate 1 being maintained at, e.g. 950 deg.C, trimethyl gallium and NH3 are introduced into the growing chamber, and a P-type GaN layer 3 is formed. When the GaN layer 3 is formed, Mg in the AlN layer 2 is diffused in the GaN layer 3 and made active, and the P-type GaN layer 3 is formed.
申请公布号 JPH1083961(A) 申请公布日期 1998.03.31
申请号 JP19960237027 申请日期 1996.09.06
申请人 HAMAMATSU PHOTONICS KK 发明人 UCHIYAMA SHOICHI;ISHIGAMI YOSHIHIRO;SUGA HIROBUMI;OTA MASASHI
分类号 H01L21/205;H01L33/32;H01S5/00;H01S5/323 主分类号 H01L21/205
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