Deformable leadframe for overcurrent protection

摘要

A leadframe (10) for diverting current to an adjacent conductor (55) when a current in the leadframe (10) exceeds a predetermined level includes a first portion (12) for carrying a chip (13) in which an integrated circuit has been constructed. A second portion (20) is connected to receive a current that flows through at least a portion of the integrated circuit. The second portion (20), which may include a bimetallic portion (40,41), is physically deformed by the current and is located to contact the adjacent conductor (55) when the current reaches the predetermined magnitude.