| 摘要 |
PROBLEM TO BE SOLVED: To cut down the manufacturing cost by a method wherein a polyimide film is formed on a column lead material so as to form a die pad and a plurality of column leads separated from the die pad on the surface of the polyimide film by an etching process. SOLUTION: After the formation of a polyamide film on the lower surface of a column lead material, the column lead material is etched away so as to form column leads 24 and a die pad 22. Next, a metallic film 40 is formed on respective surfaces of the column leads 24, the die pad 22 and the polyimide film. Next, a chip 110 is bonded onto the metallic film 40 through the intermediary of a bonding agent 120. Successively, the bonding pads 112 provided on the surface of the chip 110 are electrically connected to the column leads 24 by bonding wires 130. Later, the chip 110, the die pad 22, the column leads 24, the wires 130, the polyimide film and the metallic film 40 are sealed up with a molding resin so as to form a package barrel 140. Finally, the polyimide film and the metallic film 40 thereon are simultaneous removed to form the package 200. |
