SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device having a mounted resin mold package containing FETs or ICs. SOLUTION: A surface wiring 80 is formed on the printed board 70 and a heat sink 60 cooling for the board is formed on the backside of the printed board 70. A front end IC 10 is mounted, facing its package face to the backside of the board, in the first perforated hole 71 made on the printed board 70. A preamplifier 20 having a heat sink on its backside is mounted in the second perforated hole 72 made on the printed board 70 and a heat sink of the preamplifier 20 is contacted on the heat sink 60 of the board through solder or paste.