| 摘要 |
PROBLEM TO BE SOLVED: To realize a conductive material for an electronic component, which is restrained from deteriorating in solderability when the conductive material is heated in a manufacturing process by a method wherein a base layer of Ni or Ni alloy is formed on the surface of a conductive base body, an intermediate layer of Pd or Pd alloy prescribed in thickness is formed thereon, and a surface layer of Au or Au alloy prescribed in thickness is formed thereon. SOLUTION: A conductive base body is formed of an arbitrary metal material such as Cu or Cu alloy wire of high electrical conductivity. A base layer is formed of Ni or Ni alloy which has high heat resistant properties. An intermediate layer is formed of Pd or Pd alloy which improves a conductive material of this constitution in solderability. The intermediate layer is formed as think as 0.005 to 0.1μm. A surface layer is formed of Au or Au alloy which has high resistance to oxidation and enhance the conductive material of this constitution in solderability. The surface layer is formed as thick as 0.001μm (monoatomic layer) to 0.1μm. A conductive base body is successively plated with a base layer, an intermediate layer, and a surface layer. By this setup, the conductive base body excellent in solderability can be obtained. |
