发明名称 Semiconductor wafer for epitaxially grown devices having a sub-surface getter region
摘要 In a semiconductor wafer according to this invention, an epitaxial layer is formed on the surface of a semiconductor substrate, a second element which is not the same but homologous as a first element constituting the semiconductor substrate is present to have a peak concentration on the semiconductor substrate side rather than the surface, and this peak concentration is 1x1016 atoms/cm3 or more.
申请公布号 US5734195(A) 申请公布日期 1998.03.31
申请号 US19960636887 申请日期 1996.04.24
申请人 SONY CORPORATION 发明人 TAKIZAWA, RITSUO;KUSAKA, TAKAHISA;HIGUCHI, TAKAYOSHI;KANBE, HIDEO;OHASHI, MASANORI
分类号 H01L21/20;H01L21/265;H01L21/322;H01L27/148;H01L29/167;H01L29/36;(IPC1-7):H01L29/04;H01L21/306 主分类号 H01L21/20
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