| 摘要 |
PROBLEM TO BE SOLVED: To improve packaging density of a board. SOLUTION: A lead 22 consisting of an inner lead 22a and a bottom lead 22b extending downward and curved from the inner lead 22a is formed, and semiconductor chips 20a, 20b are mounted respectively on both surfaces of a paddle layer 10 with a pattern of conductive wiring embedded, and the paddle layer 10 is bonded on the inner lead 22a. And a structure including the semiconductor chips 20a, 20b is formed with molding resin 25. |
