| 摘要 |
PCT No. PCT/JP96/00002 Sec. 371 Date Jun. 27, 1996 Sec. 102(e) Date Jun. 27, 1996 PCT Filed Jan. 4, 1996 PCT Pub. No. WO96/21233 PCT Pub. Date Jul. 11, 1996A chip-type composite electronic component according to the present invention comprises an insulating substrate (1), a common electrode (2) formed on the substrate (1), a plurality of individual electrodes (3a-3h) formed on the substrate (1) to be spaced from the common electrode (2), and a plurality of electronic elements (4a-4e) each interposed between each of the individual electrodes (3a-3h) and the common electrode (2). Each of the common electrode (2) and individual electrodes (3a-3h) has a plated solder layer as an outermost layer. Each of the electronic elements (4a-4e) has a direct current resistance of no less than 47K OMEGA , and the solder layer of the common electrode (2) has a layer thickness which is no more than 2.9 times as great as that of the solder layer of the individual electrodes (3a-3h).
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