| 摘要 |
PURPOSE:To prevent the generation of a crack by a method wherein a photosensitive resin composition coat layer is provided on the circuit element formation surface of a semiconductor chip, the coat layer is used as a bonding agent, a plurality of inner leads are bonded to the chip, the inner leads are connected with the chip through bonding wires and a resin-sealing is performed. CONSTITUTION:A coat layer consisting of a photosensitive resin composition obtainable by making a diamine component, which consists of 100 to 20mol% of a diamine compound, which is shown in the formula I and has a photosensitive group, and 0 to 80mol% of a diamine compound which is shown in the formula I and has not a photosensitive group, react with a di-anhydride component, which consists of 5 to 60mol% of a siloxane group-containing tetracarboxylic acid di-anhydride, which is shown in the formula II, and 40 to 95mol% of a di-anhydride which is shown in the formula II and has not a siloxane group, is provided on a circuit element formation surface of a semiconductor chip and this coat layer is used as a bonding agent. Thereby, a bonding of the chip to a lead frame becomes possible at a low temperature and moreover, the vaporization and expansion of moisture-absorbed water content in a package at the time of a reflow are reduced. |
