| 摘要 |
A thin film printed board precursor containing a laminate of a dielectric thermosetting resin film layer (6) and a heat and electrically conductive metal foil layer (5) in direct adhesive bonding with a side of the resin film (6), optionally containing a supporting layer (22) comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer (6), wherein the dielectric thermosetting resin layer (6) has an unimpeded thickness that is at least equal to that of the foil layer (5) bonded to it.
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