| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and an equipment capable of excellently cutting a semiconductor wafer in a short time by a wire so as not to generate a residual section in cutting. SOLUTION: First and second tilted plates 23, 24 mutually tilted in the opposite directions are arranged on a wafer susceptor 7, and first and second laminated type semiconductor wafers 6a, 6b are disposed on these tilted plates through holders 9a, 9b and glass bases 10a, 10b. Accordingly, the first and second laminated type semiconductor wafers 6a, 6b are tilted mutually in the opposite directions. The tilt angles of the semiconductor wafers 6a, 6b are conformed approximately at angles by the deflection of a wire 8 between first and second rollers 12, 13.</p> |
