发明名称 Tape carrier for increasing the number of terminals between the tape carrier and a substrate
摘要 A tape carrier for increasing the number of terminals between the tape carrier and a substrate includes a film, a lead, a terminal and a connection. The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions. The lead is provided on the first surface of the film and extends above the opening of the film. The lead is coupled to the device at the opening of the film when the device is received by the first surface of the film. The terminal is provided on the second surface in the first region of the film. The connection connects the lead to the terminal. The lead and the device are connected together by thermocompression bonding with a thermode inserted into the opening of the film.
申请公布号 US5731630(A) 申请公布日期 1998.03.24
申请号 US19950403626 申请日期 1995.03.14
申请人 NEC CORPORATION 发明人 SUYAMA, TAKAYUKI;HASEGAWA, SHINICHI
分类号 H01L21/60;H01L21/607;H01L23/31;H01L23/495;(IPC1-7):H01L23/48 主分类号 H01L21/60
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