| 摘要 |
PROBLEM TO BE SOLVED: To simplify the process for manufacturing a semiconductor device by a method, wherein first connection pads are provided on the surface of a semiconductor chip, a first insulating layer is formed on the region of the chip excluding the connection pads and a second insulating layer, barrier metal layers, conductive bonding meterial layers, second connection pads, and a wiring board are sequentially formed on the first insulating layer. SOLUTION: First connection pads 2 are provided on the surface of a semiconductor chip 1 and a first insulating layer 3 is formed on the region of the chip 1, excluding the pads 2. A second insulating layer 4 having openings on the pads 2 is formed on the layer 3 and, at the same time, recessed part-shaped barrier metal layers 5 are formed on the pads 2 and the inner walls of the openings. Conductive bonding material layers 8 are made to be bonded to the interiors of recessed parts formed in the layers 5, and a wiring board 6 is provided on the layers 8 via second connection pads 7. Thereby the process for manufacturing a semiconductor device is made simple, and the cost of the device can be reduced. |
