| 摘要 |
PROBLEM TO BE SOLVED: To enable a joint between a semiconductor device and a circuit board to be enhanced in mechanical strength, so as to improve the assembly composed of them in quality by a method, wherein the semiconductor device and the circuit board are bonded together with a bonding layer of conductive resin adhesive agent, a reinforcing layer of first insulating resin, and sealing resin. SOLUTION: A bonding layer 3 of conductive adhesive agent is formed near the tip of its projecting electrode 5 by transfer. Then, a reinforcing layer 9 of first insulating thermoplastic resin is formed near the center of a semiconductor device 4. The semiconductor device 4 is placed on a circuit board 2 facing down, so as to electrically connect its the projecting electrode 5 to the terminal electrode 1 of the circuit board 2, and then the reinforcing layer 9 is hardened by heating, so as to reinforce the semiconductor device 4 and the circuit board 2. When the reinforcing layer 9 is cured, small spongy voids 11 are formed inside the reinforcing layer 9. When heating continues after the reinforcing layer 9 is cured, an electrical connection between the projecting electrode 5 of the semiconductor device 4 and the terminal electrode 1 of the circuit board 2 can be improved. |
