发明名称 |
CONDUCTOR FORMATION METHOD FOR MAGNETIC HEAD TRANSDUCER, SOLDERED COUPLING, HEAD SUSPENSION ASSEMBLY, AND MAGNETIC RECORDING DISK FILE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an electric soldered joint between a thin film magnetic transducer and a conductor of a joint suspension after mechanically attaching the thin film magnetic transducer to the suspension, and further provide such soldered coupling, a head suspension assembly including the thin film magnetic head transducer, and a magnetic recording disk file including the head suspension assembly. SOLUTION: A solder ball 32 is disposed between an end pad 18 of a thin film magnetic head and a lead pad 28 of a conductor by means of a capillary tube 32. The solder ball is irradiated with a converged laser beam 34 to be reflowed. The resulting soldered joint provides a pair of extremely thin layers made of an intermediate compound in a region which is in contact with the thin film magnetic head and the end pad. |
申请公布号 |
JPH1079105(A) |
申请公布日期 |
1998.03.24 |
申请号 |
JP19970162388 |
申请日期 |
1997.06.19 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
SUUYA PATSUTANAIKU |
分类号 |
B23K26/00;B23K1/005;B23K35/26;G11B5/127;H05K3/34 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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